The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Aug. 15, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H05K 1/11 (2006.01); H01L 21/56 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/563 (2013.01); H05K 3/305 (2013.01); H05K 3/3436 (2013.01); H05K 3/28 (2013.01); H05K 2201/048 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/10977 (2013.01);
Abstract
A package substrate includes an insulating layer; and circuit patterns formed on the insulating layer and divided into pad areas and pattern areas that have different heights. In one aspect, there can be a non-conductive paste (NCP) interposed between the circuit patterns and pads of a die connected to the circuit patterns to fix the die onto the insulating layer.