The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Mar. 14, 2013
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Hirofumi Ebe, Osaka, JP;
Yoshihiro Furukawa, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); B23K 35/24 (2006.01); H05K 1/11 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); B23K 35/24 (2013.01); H05K 1/11 (2013.01); H05K 3/323 (2013.01); H05K 3/368 (2013.01); H05K 13/04 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10977 (2013.01); Y10T 428/31529 (2015.04); Y10T 428/31678 (2015.04);
Abstract
A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.