The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Nov. 27, 2012
Katsumi Mizuno, Yokohama, JP;
Kazuhiko Konomi, Yokohama, JP;
Yutaka Natsume, Yokohama, JP;
Ryo Miyakoshi, Tsukuba, JP;
Takeshi Kondo, Tsukuba, JP;
Katsumi Mizuno, Yokohama, JP;
Kazuhiko Konomi, Yokohama, JP;
Yutaka Natsume, Yokohama, JP;
Ryo Miyakoshi, Tsukuba, JP;
Takeshi Kondo, Tsukuba, JP;
NHK SPRING CO., LTD., Kanagawa, JP;
SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo, JP;
Abstract
A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A metal-based circuit board includes a metal substrate, an insulation layer disposed on the metal substrate, and a circuit pattern disposed on the insulation layer. The insulation layer contains a liquid crystal polyester and 50% by volume or more of an inorganic filler. The inorganic filler is made of boron nitride and at least one of aluminum nitride and aluminum oxide. A proportion of boron nitride in the inorganic filler is within a range of 35 to 80% by volume.