The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Feb. 27, 2015
Applicant:

Metrospec Technology, Llc, Mendota Heights, MN (US);

Inventors:

Henry V. Holec, Mendota Heights, MN (US);

Wm. Todd Crandell, Minnetonka, MN (US);

Assignee:

Metrospec Technology, L.L.C., Mendota Heights, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 1/02 (2006.01); H01R 4/02 (2006.01); H01R 12/52 (2011.01); H01R 13/717 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/36 (2006.01); F21Y 101/02 (2006.01); F21Y 111/00 (2016.01);
U.S. Cl.
CPC ...
H05K 1/0293 (2013.01); H01R 4/02 (2013.01); H01R 9/096 (2013.01); H01R 12/523 (2013.01); H01R 13/717 (2013.01); H05K 1/0266 (2013.01); H05K 1/0292 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 1/113 (2013.01); H05K 1/118 (2013.01); H05K 1/14 (2013.01); H05K 1/144 (2013.01); F21Y 2101/02 (2013.01); F21Y 2111/005 (2013.01); H05K 1/0269 (2013.01); H05K 1/147 (2013.01); H05K 3/0061 (2013.01); H05K 3/363 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2027 (2013.01); H05K 2203/0228 (2013.01);
Abstract

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.


Find Patent Forward Citations

Loading…