The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Feb. 07, 2011
Applicants:
Naoki Kobayashi, Tokyo, JP;
Hiroshi Toyao, Tokyo, JP;
Noriaki Ando, Tokyo, JP;
Inventors:
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/00 (2006.01); H05K 1/03 (2006.01); H01K 3/10 (2006.01); H05K 1/02 (2006.01); H01Q 15/00 (2006.01); H01P 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); H01P 1/2005 (2013.01); H01Q 15/006 (2013.01); H01Q 15/008 (2013.01); Y10T 29/49165 (2015.01);
Abstract
A structure () includes ground conductive bodies (and) that are formed in an A layer () and a D layer () that face each other, a connection member () that connects between the ground conductive bodies (and), a conductive part () that is formed in a C layer () and faces the ground conductive bodies (and), and an opening (), through which the connection member () passes through, disposed in the conductive part (), and a conductive element () that is formed in a B layer (), faces the conductive part (), and is electrically connected to the connection member () that passes through an opening () disposed in the conductive part ().