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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9357630 B1

PDFFull Text
Date of Patent:
May. 31, 2016

Filed:

Jul. 27, 2012

Epoxy resin compound and radiant heat circuit board using the same

Applicants:

Sung Bae Moon, Seoul, KR;

Jae Man Park, Seoul, KR;

Jong Heum Yoon, Seoul, KR;

Hae Yeon Kim, Seoul, KR;

IN Hee Cho, Seoul, KR;

Inventors:

Sung Bae Moon, Seoul, KR;

Jae Man Park, Seoul, KR;

Jong Heum Yoon, Seoul, KR;

Hae Yeon Kim, Seoul, KR;

In Hee Cho, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

Saliwanchik, Lloyd & Eisenschenk

Primary Examiner:

Randy Gulakowski

Assistant Examiner:

Ha Nguyen

Int. Cl.
CPC ...
C08G 59/18 (2006.01); C08G 59/20 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); H05K 1/05 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); C08G 59/184 (2013.01); C08L 63/00 (2013.01); H01L 23/142 (2013.01); H01L 23/3737 (2013.01); H05K 1/0373 (2013.01); H05K 1/056 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/0209 (2013.01);
Abstract

Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

Find Patent Forward Citations

Moon, Sung. (2016). Epoxy resin compound and radiant heat circuit board using the same (U.S. Patent No. 9357630). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9357630

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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