The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Feb. 23, 2013
Applicant:
Futurewei Technologies, Inc., Plano, TX (US);
Inventors:
Zhengxiang Ma, Summit, NJ (US);
Daniel Plaza, Mendham, NJ (US);
Shengjun Ou, Bridgewater, NJ (US);
Alexis Pierides, Piscataway, NJ (US);
Minwei Gong, Wilmington, DE (US);
Assignee:
Futurewei Technologies, Inc., Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 19/10 (2006.01); H01Q 3/26 (2006.01); H04W 84/04 (2009.01); H01Q 1/02 (2006.01); H01Q 1/42 (2006.01); H01Q 1/24 (2006.01); H01Q 21/20 (2006.01);
U.S. Cl.
CPC ...
H01Q 19/10 (2013.01); H01Q 1/02 (2013.01); H01Q 1/246 (2013.01); H01Q 1/42 (2013.01); H01Q 3/26 (2013.01); H01Q 19/106 (2013.01); H04W 84/042 (2013.01); H01Q 21/205 (2013.01);
Abstract
On-board heat dissipation can be achieved in radio frequency (RF) modules by integrating a heat sink into the RF module's antenna reflector. Said integration achieves a compact and aesthetically pleasing RF module design that reduces the overall footprint of modular active antenna systems (AASs). Embodiment antenna reflectors include portions that are perforated and/or exposed to free flowing air to provide enhanced heat dissipation capability.