The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Feb. 13, 2015
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Chih-Chen Lai, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/08 (2010.01); H01L 33/64 (2010.01); H01L 33/42 (2010.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); H01L 33/08 (2013.01); H01L 33/20 (2013.01); H01L 33/642 (2013.01); H01L 33/42 (2013.01); H01L 2933/0075 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A method for manufacturing an LED chip, comprising steps: making a substrate and an epitaxy structure formed on the substrate, the epitaxy structure comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer; defining a plurality of grooves in the epitaxy structure to expose the light emitting layer; and filling a transparent insulative material in the plurality of grooves; wherein the plurality of grooves comprise a plurality of first grooves and a plurality of second grooves different from the plurality of first grooves, wherein the plurality of second grooves are spaced differently from the plurality of first grooves.


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