The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Aug. 21, 2014
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Ki Hong Lee, Gyeonggi-do, KR;

Seung Ho Pyi, Gyeonggi-do, KR;

Seok Min Jeon, Gyeonggi-do, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11575 (2013.01); H01L 27/11548 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract

A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes insulating layers stacked in the shape of stairs, and conductive layers alternately stacked with the insulating layers, wherein the conductive layers each include a first region interposed between upper and lower insulating layers thereof, among the insulating layers, and a second region which extends from the first region and protrudes between the upper and lower insulating layers, and wherein a protruding part formed on a sidewall or an upper surface of the second region.


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