The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
May. 28, 2015
Samsung Electronics Co., Ltd., Suwon-si, KR;
Young-woo Park, Hwaseong-si, KR;
Abstract
A semiconductor package includes a package substrate including a ground pad; a a conductive spacer and a first semiconductor chip disposed on the package substrate; a second semiconductor chip on the conductive spacer and the first semiconductor chip; a molding unit that covers the package substrate, the first semiconductor chip, the second semiconductor chip, and a first portion of the conductive spacer, and exposes a second portion of the conductive spacer; and an electromagnetic interference (EMI) shield that covers the molding unit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile