The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Jul. 08, 2013
Applicant:
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Adam Gallegos, Fort Collins, CO (US);
Walter J. Dauksher, Fort Collins, CO (US);
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/16 (2006.01); H01L 23/498 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/16 (2013.01); H01L 23/3675 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/92 (2013.01); H01L 2224/10155 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/26155 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/8346 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83411 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/167 (2013.01); H01L 2924/1659 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01); H05K 1/141 (2013.01); H05K 3/3436 (2013.01); H05K 2201/041 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A chip package and methods of manufacturing the same are disclosed. In particular, a chip package comprising a ball grid array is disclosed in which the chip package includes a package substrate supporting the ball grid array and in which the chip package further includes a warpage control frame that helps to minimize or mitigate warpage of the chip package.