The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Apr. 28, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Hyo-soon Kang, Seoul, KR;
Sun-won Kang, Seongnam-si, KR;
Joon-young Park, Seoul, KR;
Doo-hee Hwang, Seongnam-si, KR;
Tae-young Yoon, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 2924/014 (2013.01); H01L 2924/15331 (2013.01);
Abstract
A printed circuit board (PCB) includes a base substrate including upper and lower surfaces, a plurality of solder ball pads separately formed on the lower surface of the base substrate in a radial direction and forming one or more radial pad groups, a plurality of first traces respectively connected to the plurality of solder ball pads and extending to an inside of the radial pad group, and a plurality of second traces respectively connected to the plurality of first traces and extending to an outside of the radial pad group.