The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Oct. 17, 2014
Jongkook Kim, Hwaseong-si, KR;
Jangwoo Lee, Cheonan-si, KR;
Kyoungsei Choi, Yongin-si, KR;
Sayoon Kang, Seoul, KR;
Donghan Kim, Osan-si, KR;
Hwanggil Shim, Seoul, KR;
Jongkook Kim, Hwaseong-si, KR;
Jangwoo Lee, Cheonan-si, KR;
Kyoungsei Choi, Yongin-si, KR;
Sayoon Kang, Seoul, KR;
Donghan Kim, Osan-si, KR;
Hwanggil Shim, Seoul, KR;
Abstract
Package-on-package (POP) devices and methods of manufacturing the POP devices are provided. In the POP devices, a thermal interface material layer disposed between lower and upper semiconductor packages may contact about 70% or greater of an area of a top surface of a lower semiconductor chip. According to methods, the upper semiconductor package may be mounted on the lower semiconductor chip using a weight.