The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Mar. 12, 2015
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventor:
Toshiyuki Miyanagi, Azumino, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/34 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/295 (2013.01); H01L 23/296 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/4846 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A surface of a power semiconductor chip, mounted within a power semiconductor module and not being opposed to a wiring thin film, and a surface of a bonding wire are sealed with a resin that does not contain a thermally-conductive filler, and the resin that does not contain a thermally-conductive filler is sealed with a resin that contains a thermally-conductive filler.