The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Jun. 18, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Tatsuto Nishihara, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4825 (2013.01); H01L 21/4817 (2013.01); H01L 21/4871 (2013.01);
Abstract
A method of manufacturing a semiconductor device includes the steps of placing, on a heat sink made of a metal, a semiconductor element and a frame surrounding the semiconductor element, placing solder on an upper surface of the frame, placing a cap on the solder, and heating the solder while exerting on the cap a force to be applied toward the frame without scrubbing the cap on the frame. In the heating step a heat source is brought into contact with the heat sink and the solder is heated with the heat source.