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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9354512 B1

PDFFull Text
Expired
Date of Patent:
May. 31, 2016

Filed:

Aug. 06, 2010

Resin mold for imprinting and method for producing the same

Applicants:

Takahide Mizawa, Sayama, JP;

Satoshi Uehara, Sayama, JP;

Inventors:

Takahide Mizawa, Sayama, JP;

Satoshi Uehara, Sayama, JP;

Assignee:

Soken Chemical & Engineering Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Alison L Hindenlang

Assistant Examiner:

Lawrence D Hohenbrink, Jr

Int. Cl.
CPC ...
B29C 59/02 (2006.01); G03F 7/00 (2006.01); B29C 33/56 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/11 (2006.01); B29C 33/60 (2006.01); B29C 33/40 (2006.01); B29C 33/42 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 33/56 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); B29C 33/40 (2013.01); B29C 33/424 (2013.01); B29C 33/60 (2013.01); G03F 7/11 (2013.01);
Abstract

Provided is a resin mold for imprinting which is free from transfer defects, has excellent releasability from a resin subjected to imprinting, and does not cause any defect by imprinting. The resin mold for imprinting includes a resin layer having a recessed and projected pattern surface, an inorganic material layer formed with a uniform thickness on at least the recessed and projected pattern surface of the resin layer, and a release agent layer formed with a uniform thickness on at least the recessed and projected pattern surface of the inorganic material layer.

Find Patent Forward Citations

Mizawa, Takahide. (2016). Resin mold for imprinting and method for producing the same (U.S. Patent No. 9354512). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9354512

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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