The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Sep. 24, 2014
Applicant:
Stmicroelectronics SA, Montrouge, FR;
Inventor:
Pascal Fonteneau, Theys, FR;
Assignee:
STMicroelectronics SA, Montrouge, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/122 (2006.01); H01L 25/16 (2006.01); H01L 27/02 (2006.01); H01L 23/60 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/122 (2013.01); H01L 23/60 (2013.01); H01L 25/0652 (2013.01); H01L 25/167 (2013.01); H01L 27/0248 (2013.01); G02B 2006/12061 (2013.01); H01L 24/16 (2013.01); H01L 2224/16235 (2013.01); H01L 2225/06534 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1431 (2013.01);
Abstract
A device includes integrated circuit chips mounted on one another. At least one component for protecting elements of a second chip is formed in a first chip. The chips may be of the SOI type, with the first chip including a first SOI layer having a first thickness and the second chip including a second SOI layer having a second thickness smaller than the first thickness. The first chip including the component for protecting may include an optical waveguide with the component for protecting formed adjacent the optical waveguide.