The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Jul. 30, 2014
Hewlett-packard Development Company, L.p., Houston, TX (US);
Michael Renne Ty Tan, Palo Alto, CA (US);
Georgios Panotopoulos, Palo Alto, CA (US);
Paul Kessler Rosenberg, Palo Alto, CA (US);
Sagi Varhgese Mathai, Palo Alto, CA (US);
Wayne Victor Sorin, Palo Alto, CA (US);
Susant K. Patra, Palo Alto, CA (US);
Hewlett Packard Enterprise Development LP, Houston, TX (US);
Abstract
A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.