The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Mar. 11, 2010
Applicants:

Yoshihiro Nagano, Kyoto, JP;

Masaki Ohfuji, Kyoto, JP;

Junichiro Kozaki, Kyoto, JP;

Inventors:

Yoshihiro Nagano, Kyoto, JP;

Masaki Ohfuji, Kyoto, JP;

Junichiro Kozaki, Kyoto, JP;

Assignee:

SHIMADZU CORPORATION, Kyoto-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F04D 19/04 (2006.01); F04D 25/06 (2006.01); F04D 29/58 (2006.01);
U.S. Cl.
CPC ...
F04D 19/042 (2013.01); F04D 25/068 (2013.01); F04D 29/5813 (2013.01);
Abstract

A turbomolecular pump device includes: a turbomolecular pump main body; a power unit that drives the turbomolecular pump main body; and a water cooling unit that is provided between the turbomolecular pump main body and the power unit, wherein components provided in a casing of the power unit are classified into an intensive cooling required component that requires intensive cooling, a moderate cooling required component that requires moderate cooling, and a no cooling required component that requires substantially no cooling, the intensive cooling required component is mounted on a first high-conductivity substrate contacting to the water cooling unit, the moderate cooling required component is mounted on a second high heat-conductive substrate contacting to an inner surface of the casing, and the no cooling required component is mounted on a substrate arranged in a space between the first high heat-conductive substrate and the second high heat-conductive substrate.


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