The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Feb. 06, 2014
Canon Kabushiki Kaisha, Tokyo, JP;
Tomohiro Takahashi, Yokohama, JP;
Takayuki Ono, Kawasaki, JP;
Masao Furukawa, Yokohama, JP;
Jun Hinami, Kawasaki, JP;
Takeshi Shibata, Yokohama, JP;
Ryo Shimamura, Yokohama, JP;
Takanori Enomoto, Tokyo, JP;
Shimpei Otaka, Kawasaki, JP;
Masashi Ishikawa, Chofu, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.