The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Aug. 05, 2013
Applicant:

Materials Solutions, Worcester, GB;

Inventor:

Trevor Illston, Worcestershire, GB;

Assignee:

Materials Solutions, Worchester, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B23K 26/342 (2014.01); B23K 26/34 (2014.01); B29C 67/00 (2006.01); B22F 3/15 (2006.01); C22C 19/05 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); B22F 3/00 (2006.01); B22F 3/24 (2006.01);
U.S. Cl.
CPC ...
B23K 26/345 (2013.01); B22F 3/105 (2013.01); B22F 3/1055 (2013.01); B22F 3/15 (2013.01); B23K 26/342 (2015.10); B23K 35/0244 (2013.01); B23K 35/3033 (2013.01); B29C 67/0077 (2013.01); C22C 19/055 (2013.01); C22C 19/056 (2013.01); C22C 19/057 (2013.01); B22F 3/00 (2013.01); B22F 2003/248 (2013.01); Y02P 10/295 (2015.11);
Abstract

Methods of additive manufacturing a superalloy component are disclosed. In one method a powder bed of superalloy powder is selectively scanned with a focused laser beam in a line-by-line manner; and the spacing between adjacent scan lines is no more than twice the layer thickness being formed. In another method a compressive stress treatment is applied to the surface of the final component prior to separation of said component from the substrate. In a further method a superalloy component is formed on a substrate and the method includes Hot Isostatic Processing of the component wherein the mass of the substrate is reduced prior to the Hot Isostatic Processing. The methods may be combined in a multi-step process.


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