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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9352408 B1

PDFFull Text
Date of Patent:
May. 31, 2016

Filed:

Sep. 12, 2013

Solder joint structure and solder joining method

Applicant:

Nidec Corporation, Kyoto, JP;

Inventor:

Tomoyoshi Yokogawa, Kyoto, JP;

Assignee:

NIDEC CORPORATION, Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Gregory Binda

Assistant Examiner:

Nahid Amiri

Int. Cl.
CPC ...
B25G 3/34 (2006.01); F16B 11/00 (2006.01); F16B 12/04 (2006.01); F16L 13/00 (2006.01); B23K 1/14 (2006.01); B23K 1/00 (2006.01); B23K 1/08 (2006.01); B23K 1/19 (2006.01); B23K 1/20 (2006.01); B23K 3/06 (2006.01);
U.S. Cl.
CPC ...
B23K 1/14 (2013.01); B23K 1/0016 (2013.01); B23K 1/08 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B23K 1/203 (2013.01); B23K 3/0661 (2013.01); B23K 3/0669 (2013.01); B23K 2201/32 (2013.01); B23K 2201/34 (2013.01); B23K 2201/38 (2013.01); B23K 2203/10 (2013.01); B23K 2203/12 (2013.01); B23K 2203/18 (2013.01); Y10T 403/479 (2015.01);
Abstract

A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface.

Find Patent Forward Citations

Yokogawa, Tomoyoshi. (2016). Solder joint structure and solder joining method (U.S. Patent No. 9352408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9352408

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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