The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Mar. 08, 2013
Applicants:
Milind Raje, Wentworthville, AU;
Robert Bennett, St. Peters, AU;
Andrew Mudie, Petersham, AU;
Gary Mark Ignacio, Woolloomooloo, AU;
Inventors:
Milind Raje, Wentworthville, AU;
Robert Bennett, St. Peters, AU;
Andrew Mudie, Petersham, AU;
Gary Mark Ignacio, Woolloomooloo, AU;
Assignee:
Cochlear Limited, Macquarie University, NSW, AU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/06 (2006.01); B23K 26/00 (2014.01); H05K 13/04 (2006.01); B23K 20/00 (2006.01); A61N 1/375 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); A61N 1/36 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); A61N 1/3754 (2013.01); B23K 1/06 (2013.01); B23K 20/004 (2013.01); B23K 26/21 (2015.10); H05K 3/4015 (2013.01); A61N 1/36032 (2013.01); H01L 2924/0002 (2013.01); H05K 3/3478 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0379 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/10318 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/049 (2013.01); H05K 2203/107 (2013.01);
Abstract
Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.