The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Apr. 03, 2013
Applicants:

Jong-hwan Kim, Yongin, KR;

Yong-youl Cho, Yongin, KR;

Inventors:

Jong-Hwan Kim, Yongin, KR;

Yong-Youl Cho, Yongin, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 13/046 (2013.01); B23K 20/002 (2013.01); B23K 20/02 (2013.01); B23K 20/233 (2013.01); B23K 2201/42 (2013.01); H05K 3/361 (2013.01);
Abstract

A bonding apparatus for a display device includes a film bonding device configured to attach an anisotropic conductive film to a panel, and a pressure device configured to bond a driving chip and a flexible printed circuit to the panel. The pressure device includes a pressure head including a heat source, a pressure tip attached to a bottom side of the pressure head and the pressure tip being configured to press the flexible printed circuit to the panel, and a transfer unit attached to an upper side of the pressure head, the transfer unit being configured to transfer the pressure head. The heat source is located in the pressure head.


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