The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Nov. 21, 2011
Applicant:

Hirotaka Satake, Tottori, JP;

Inventor:

Hirotaka Satake, Tottori, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01P 1/20 (2006.01); H01P 1/203 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H03F 3/24 (2006.01); H03F 3/60 (2006.01); H03F 3/195 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01P 1/20345 (2013.01); H03F 3/195 (2013.01); H03F 3/24 (2013.01); H03F 3/245 (2013.01); H03F 3/60 (2013.01); H01L 23/3677 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/142 (2013.01); H01L 2924/19051 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H03F 2200/06 (2013.01); H03F 2200/09 (2013.01); H03F 2200/165 (2013.01); H03F 2200/171 (2013.01); H03F 2200/294 (2013.01); H03F 2200/534 (2013.01); H03F 2200/541 (2013.01);
Abstract

An electronic device comprising a laminate comprising pluralities of insulator layers each provided with conductor patterns, and an amplifier-constituting semiconductor device mounted to a mounting electrode formed on an upper surface of the laminate, a first ground electrode being formed on an insulator layer near an upper surface of the laminate; a second ground electrode being formed on an insulator layer near a lower surface of the laminate; the first ground electrode being connected to the mounting electrode through pluralities of via-holes; conductor patterns constituting the first circuit block being disposed in a region below the amplifier-constituting semiconductor device between the first ground electrode and the second ground electrode; and at least part of a conductor pattern for a line connecting the first circuit block to the amplifier-constituting semiconductor device being disposed on an insulator layer sandwiched by the mounting electrode and the first ground electrode.


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