The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Nov. 26, 2014
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Shingo Yoshioka, Osaka, JP;

Hiroaki Fujiwara, Fukushima, JP;

Hiromitsu Takashita, Osaka, JP;

Tsuyoshi Takeda, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/38 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/4846 (2013.01); H01L 23/49811 (2013.01); H05K 3/107 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/3011 (2013.01); H05K 3/184 (2013.01); H05K 3/38 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0565 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49155 (2015.01);
Abstract

A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.


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