The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Apr. 04, 2013
Applicant:
GM Global Technology Operations Llc, Detroit, MI (US);
Inventors:
Lisa M. Albaugh, Frankfort, IN (US);
David A. Smith, Kokomo, IN (US);
Timothy J. Guse, Peru, IN (US);
Assignee:
GM GLOBAL TECHNOLOGY OPERATIONS LLC, Detroit, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/037 (2014.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/095 (2013.01); C09D 11/037 (2013.01); C09D 11/52 (2013.01); H05K 3/1291 (2013.01); H05K 3/1233 (2013.01); Y10T 428/31678 (2015.04);
Abstract
Thick film conductive inks for electronic devices, methods for making electronic devices using thick film conductive inks, and electronic devices fabricated by such methods are provided herein. In one example, a thick film conductive ink includes an organic portion and an inorganic portion. The inorganic portion is dispersed in the organic portion to define a paste. The inorganic portion includes metallic copper powder, cupric oxide, and elemental boron. The thick film conductive ink includes substantially no glass.