The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Sep. 26, 2012
Applicant:

Lg Display Co., Ltd., Chicago, IL (US);

Inventors:

Sang Dae Lee, Mapo-gu, KR;

Kyeong Kun Jang, Namdong-gu, KR;

Min Su Cho, Paju-si, KR;

Young Mee Kim, Paju-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); F21V 8/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); G02B 6/0085 (2013.01); G02F 1/1336 (2013.01); G02F 1/133603 (2013.01); G02B 6/009 (2013.01); G02B 6/0055 (2013.01); G02B 6/0088 (2013.01); G02F 2001/133612 (2013.01); H05K 1/0284 (2013.01); H05K 1/056 (2013.01); H05K 2201/0358 (2013.01); H05K 2201/10409 (2013.01);
Abstract

A backlight assembly is disclosed that is capable of enabling easy narrow bezel design and easily radiating heat generated from a light source, and a liquid crystal display device using the same. The backlight assembly includes a bottom cover, a light guide plate placed on the bottom cover, a printed circuit board having an L-shaped form and attached to a bottom surface and inner lateral surface of the bottom cover, and a plurality of Light Emitting Diode (LED) packages being mounted to the printed circuit board, wherein the printed circuit board includes a single metal layer having the L-shaped form and attached to the bottom surface and the inner lateral surface of the bottom cover; and a Resin Coated Copper (RCC) film attached to an inner lateral surface of the single metal layer.


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