The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Oct. 10, 2012
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Toshiaki Nagai, Kanagawa, JP;

Ken Koseki, Kanagawa, JP;

Yosuke Ueno, Kanagawa, JP;

Atsushi Suzuki, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/374 (2011.01); H04N 5/378 (2011.01); H03M 1/08 (2006.01); H04N 5/359 (2011.01); H03M 1/56 (2006.01); H03M 1/12 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 5/378 (2013.01); H03M 1/0863 (2013.01); H04N 5/359 (2013.01); H01L 27/14618 (2013.01); H01L 2924/0002 (2013.01); H03M 1/123 (2013.01); H03M 1/56 (2013.01);
Abstract

A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. A first chip and a second chip are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip having a function of sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and a function of quantizing the sampled signals to obtain digital signals.


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