The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

May. 20, 2015
Applicant:

Dongguan Amperex Technology Limited, Dongguan, Guangdong, CN;

Inventors:

Shaoyu Chen, Guangdong, CN;

Conghui You, Guangdong, CN;

Dong Duan, Guangdong, CN;

Chunjiang Xiang, Guangdong, CN;

Jianqun Xiong, Guangdong, CN;

Hongxin Fang, Guangdong, JP;

Assignee:

DONGGUAN AMPEREX TECHNOLOGY LIMITED, Dongguan, Guangdong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/04 (2006.01); H01M 10/0525 (2010.01); H01M 10/058 (2010.01); H01M 10/0583 (2010.01); H01M 2/02 (2006.01);
U.S. Cl.
CPC ...
H01M 10/0404 (2013.01); H01M 2/02 (2013.01); H01M 10/058 (2013.01); H01M 10/0525 (2013.01); H01M 10/0583 (2013.01); Y10T 29/53135 (2015.01);
Abstract

The present invention belongs to the technical field of lithium ion battery production equipment, and particularly relates to a double-folding device for softly-packaged lithium ion batteries, comprising a rack, and a loaded-material positioning mechanism, a primary folding mechanism and a secondary folding mechanism which are arranged on the rack in turn. A bonding layer arrangement mechanism is further provided between the primary folding mechanism and the secondary folding mechanism. In comparison to the prior art, in the present invention, by providing, between the primary folding mechanism and the secondary folding mechanism, a bonding layer arrangement mechanism which is configured as a mechanism capable of online monitoring the arrangement of a bonding layer and automatically adjusting the glue dispensing position and glue volume, the real-time adjustment of the dispensing position and volume of glue is realized.


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