The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Feb. 04, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Tsutomu Teraoka, Matsumoto, JP;

Sukenori Ichikawa, Suwa, JP;

Hirofumi Hokari, Chino, JP;

Tomofumi Yokoyama, Kai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/88 (2006.01); H01M 8/12 (2006.01); H01M 4/86 (2006.01); H01M 8/02 (2006.01); C04B 37/00 (2006.01); H01M 4/1391 (2010.01); H01M 4/04 (2006.01); H01M 4/13 (2010.01); H01M 4/139 (2010.01); B32B 5/16 (2006.01); C04B 35/01 (2006.01); C04B 35/64 (2006.01); B29C 65/00 (2006.01); H01M 4/131 (2010.01); H01M 4/64 (2006.01); B32B 38/00 (2006.01); B32B 38/08 (2006.01); B32B 37/06 (2006.01); H01M 10/052 (2010.01); H01M 10/0562 (2010.01);
U.S. Cl.
CPC ...
H01M 4/1391 (2013.01); B32B 5/16 (2013.01); C04B 35/01 (2013.01); C04B 35/64 (2013.01); C04B 37/00 (2013.01); H01M 4/0433 (2013.01); H01M 4/0471 (2013.01); H01M 4/13 (2013.01); H01M 4/139 (2013.01); B32B 37/06 (2013.01); B32B 38/08 (2013.01); B32B 2038/0064 (2013.01); B32B 2255/04 (2013.01); B32B 2260/025 (2013.01); H01M 4/131 (2013.01); H01M 4/64 (2013.01); H01M 10/052 (2013.01); H01M 10/0562 (2013.01); Y02E 60/122 (2013.01); Y02P 70/54 (2015.11);
Abstract

A method for producing an electrode assembly includes: obtaining a porous active material molded body by molding a constituent material containing a lithium multiple oxide in the form of particles by compression, and then performing a heat treatment at a temperature of 850° C. or higher and lower than the melting point of the used lithium multiple oxide; forming a solid electrolyte layer by applying a liquid containing a constituent material of an inorganic solid electrolyte to the surface of the active material molded body including the inside of each pore of the active material molded body, and then performing a heat treatment; and bonding a current collector to the active material molded body exposed from the solid electrolyte layer.


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