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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9349931 B1

PDFFull Text
Date of Patent:
May. 24, 2016

Filed:

Mar. 28, 2012

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and led device

Applicants:

Tomoo Nishiyama, Tsukuba, JP;

Atsushi Kuwano, Chikusei, JP;

Toshiaki Shirasaka, Chikusei, JP;

Naoki Hara, Chikusei, JP;

Kensuke Yoshihara, Chikusei, JP;

Hideyuki Katagi, Chikusei, JP;

Inventors:

Tomoo Nishiyama, Tsukuba, JP;

Atsushi Kuwano, Chikusei, JP;

Toshiaki Shirasaka, Chikusei, JP;

Naoki Hara, Chikusei, JP;

Kensuke Yoshihara, Chikusei, JP;

Hideyuki Katagi, Chikusei, JP;

Assignee:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Attorney:

Fanelli Haag PLLC

Primary Examiner:

Selim Ahmed

Int. Cl.
CPC ...
H01L 33/64 (2010.01); C08J 5/18 (2006.01); H01L 23/373 (2006.01); B32B 15/092 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); B32B 27/42 (2006.01); C08L 63/00 (2006.01); H01L 23/433 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); B32B 15/092 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08J 5/18 (2013.01); C08L 63/00 (2013.01); H01L 23/3737 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 24/29 (2013.01); H01L 24/33 (2013.01); B32B 2457/14 (2013.01); B32B 2457/20 (2013.01); C08J 2363/00 (2013.01); C08K 2003/385 (2013.01); C08K 2201/005 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 μm to less than 1 μm, from 1 μm to less than 10 μm, and from 10 μm to 100 μm, and the filler contains boron nitride particles having particle sizes of from 10 μm to 100 μm. In the general Formula (I), Rrepresents an alkyl group, an aryl group, or an aralkyl group. Each of Rand Rindependently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

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