The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Oct. 12, 2012
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 33/56 (2010.01); C08L 83/04 (2006.01); C08G 77/04 (2006.01); C08G 77/12 (2006.01); C08G 77/14 (2006.01); C08G 77/16 (2006.01); C08G 77/20 (2006.01); C08K 5/5425 (2006.01); C08K 5/5435 (2006.01); C08K 5/56 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08L 83/04 (2013.01); C08G 77/045 (2013.01); C08G 77/12 (2013.01); C08G 77/14 (2013.01); C08G 77/16 (2013.01); C08G 77/20 (2013.01); C08K 5/5425 (2013.01); C08K 5/5435 (2013.01); C08K 5/56 (2013.01); H01L 33/501 (2013.01); H01L 33/54 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01);
Abstract
An encapsulating sheet is formed from an encapsulating resin composition which contains an encapsulating resin and silicone microparticles, and the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %.