The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Sep. 17, 2013
Samsung Electronics Co., Ltd., Suwon-si, KR;
HeeDon Hwang, Yongin-si, KR;
JuEun Kim, Hwaseong-si, KR;
KiHong Nam, Seongnam-si, KR;
BongHyun Kim, Incheon, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device comprises a first trench formed in a substrate; a first insulating film formed on sidewalls and a bottom surface of the first trench and not formed on a top surface of the substrate; and a first conductive film formed on the first insulating film to partially fill the first trench, wherein the first insulating film comprises a first portion which overlaps the first conductive film and a second portion which does not overlap the first conductive film, wherein the second portion comprises first fixed charges.