The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Aug. 24, 2012
Kensuke Nakamura, Tokyo, JP;
Toru Meura, Tokyo, JP;
Yoji Ishimura, Tokyo, JP;
SUMITOMO BAKELITE CO., LTD., Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device () of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (B) in which semiconductor blocks (B,B,B, andB) are stacked in a state of not being solder-bonded. In the semiconductor blocks (B,B,B, andB), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body () is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (B) in a stacked semiconductor component unit.