The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Feb. 27, 2014
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Der-Ping Liu, Dayuan Township, Taoyuan County, TW;
Tai-You Lu, Zhubei, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); G06F 1/10 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G06F 1/10 (2013.01); H01L 23/528 (2013.01); H01L 23/552 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/49 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A semiconductor chip is provided. The semiconductor chip includes a first circuit, a second circuit, a third circuit, a first signal path and a second signal path. The first circuit provides a reference signal. The first signal path includes a first conductive trace and transmits the reference signal from the first circuit to the second circuit. The second signal path transmits the reference signal from the first circuit to the third circuit. Timing skews of the first and second signal paths are balanced and the first and second signal paths are routed globally.