The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Jun. 25, 2015
Applicant:

Renesas Electronics Corporation, Kanagawa, JP;

Inventors:

Yoshihiro Ono, Kanagawa, JP;

Nobuhiro Kinoshita, Kanagawa, JP;

Tsuyoshi Kida, Kanagawa, JP;

Jumpei Konno, Kanagawa, JP;

Kenji Sakata, Kanagawa, JP;

Kentaro Mori, Kanagawa, JP;

Shinji Baba, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); B23K 31/00 (2006.01); H01L 23/495 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49558 (2013.01); H01L 23/544 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/81 (2013.01);
Abstract

The reliability of a semiconductor device is improved. A probe mark is formed on a probe region of a pad covered with a protective insulating film. And, a pillar-shaped electrode has a first portion formed on an opening region and a second portion that is extended over the probe region from the upper portion of the opening region. At this time, a center position of the opening region is shifted from a center position of the pillar-shaped electrode that is opposed to a bonding finger.


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