The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Oct. 10, 2014
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventor:
Alexandre Coullomb, Izeaux, FR;
Assignee:
STMICROELECTRONICS (GRENOBLE 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/48 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/3677 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15311 (2013.01);
Abstract
An electronic device includes a substrate wafer made of many layers of an insulating material and including an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer further includes a metal plate that is integrated into the substrate wafer and thermally coupled to the integrated circuit chip. The metal plate may have a thickness in excess of several layers of the substrate wafer. The metal plate may include a duct through which a thermally conductive fluid flows.