The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Jul. 22, 2013
Applicant:

Mycartis NV, Zwijnaarde/Ghent, BE;

Inventors:

Raphael Tornay, Illarsaz, CH;

Nicolas Demierre, Chatel-St-Denis, CH;

Stephan Gamper, Lausanne, CH;

Philippe Renaud, Lausanne, CH;

Assignee:

MYCARTIS NV, Zwijnaarde/Ghent, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 13/06 (2006.01); B01L 3/00 (2006.01); B81C 99/00 (2010.01); G01N 33/543 (2006.01);
U.S. Cl.
CPC ...
H01G 13/06 (2013.01); B01L 3/508 (2013.01); B01L 3/502707 (2013.01); B01L 3/502761 (2013.01); B01L 3/54 (2013.01); B01L 3/545 (2013.01); B81C 99/008 (2013.01); G01N 33/54313 (2013.01); B01J 2219/005 (2013.01); B01J 2219/00502 (2013.01); B01J 2219/00536 (2013.01); B01J 2219/00556 (2013.01); B01J 2219/00637 (2013.01); B01L 2200/0647 (2013.01); B01L 2200/10 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0803 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/0851 (2013.01); B01L 2300/0893 (2013.01); B81B 2201/058 (2013.01); B81B 2201/06 (2013.01);
Abstract

The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first active layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first active layer, (e) etching away the bottom layer and the insulating layer, (f) removing the polymer layer to release the microcarriers.


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