The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Aug. 20, 2015
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Hitoshi Ohkubo, Tokyo, JP;

Tomokazu Ito, Tokyo, JP;

Hideto Itoh, Tokyo, JP;

Yoshihiro Maeda, Tokyo, JP;

Manabu Ohta, Tokyo, JP;

Yuuya Kaname, Tokyo, JP;

Takahiro Kawahara, Tokyo, JP;

Takashi Nakagawa, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/02 (2006.01); H01F 27/255 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0033 (2013.01); H01F 27/022 (2013.01); H01F 27/255 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 2017/0073 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.


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