The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Oct. 02, 2012
Samsung Electro-mechanics Co., Ltd., Gyunggi-do, KR;
Jin Woo Hahn, Gyunggi-do, KR;
Myeong Gi Kim, Gyunggi-do, KR;
Sung Yong An, Gyunggi-do, KR;
Ic Seob Kim, Gyunggi-do, KR;
Byeong Cheol Moon, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-do, KR;
Abstract
There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 μm≦Tg≦7 μm, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.