The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Apr. 19, 2012
Applicants:

Yoshihiro Kondo, Tokyo, JP;

Takayuki Fujimoto, Tokyo, JP;

Fumio Takeda, Tokyo, JP;

Takeshi Kato, Tokyo, JP;

Inventors:

Yoshihiro Kondo, Tokyo, JP;

Takayuki Fujimoto, Tokyo, JP;

Fumio Takeda, Tokyo, JP;

Takeshi Kato, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 7/20809 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/2072 (2013.01);
Abstract

The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.


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