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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9347620 B1

PDFFull Text
Date of Patent:
May. 24, 2016

Filed:

Jan. 09, 2014

Semiconductor device, and method of manufacturing semiconductor device

Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Hideyuki Kogure, Fukaya, JP;

Yuuta Yamada, Yokohama, JP;

Takeshi Ikuta, Yokohama, JP;

Toshiyuki Hayakawa, Yokohama, JP;

Junichi Asada, Sagamihara, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

David V Bruce

Int. Cl.
CPC ...
F21K 99/00 (2010.01); H05K 1/18 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); F21Y 101/02 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
F21K 9/30 (2013.01); H01L 21/78 (2013.01); H01L 24/97 (2013.01); H01L 25/167 (2013.01); H05K 1/186 (2013.01); F21Y 2101/02 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10159 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

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