The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Sep. 10, 2012
Applicants:

Charles L. Arvin, Poughkeepsie, NY (US);

Harry Cox, Rifton, NY (US);

Hariklia Deligianni, Tenafly, NJ (US);

George J. Scott, Wappinger Falls, NY (US);

Inventors:

Charles L. Arvin, Poughkeepsie, NY (US);

Harry Cox, Rifton, NY (US);

Hariklia Deligianni, Tenafly, NJ (US);

George J. Scott, Wappinger Falls, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); C25D 17/00 (2006.01); G01N 27/403 (2006.01); G01N 27/404 (2006.01); C25D 17/12 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 17/007 (2013.01); C25D 17/12 (2013.01); C25D 21/12 (2013.01); G01N 27/403 (2013.01); G01N 27/404 (2013.01);
Abstract

An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided.


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