The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Jul. 14, 2014
Applicant:

E I Du Pont DE Nemours and Company, Wilmington, DE (US);

Inventors:

Vincenzo Arancio, Bristol, GB;

Jay Robert Dorfman, Durham, NC (US);

Assignee:

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/02 (2006.01); C09K 5/14 (2006.01); C09D 163/00 (2006.01); H01B 17/60 (2006.01); H01B 3/40 (2006.01); H01B 3/42 (2006.01); H01B 3/30 (2006.01); H03K 17/96 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C09D 163/00 (2013.01); H01B 3/025 (2013.01); H01B 3/302 (2013.01); H01B 3/40 (2013.01); H01B 3/42 (2013.01); H01B 17/60 (2013.01); H03K 17/962 (2013.01);
Abstract

This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.


Find Patent Forward Citations

Loading…