The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Jun. 24, 2013
Applicant:
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
Liang Chen, Midland, MI (US);
Liang Hong, Schwenksville, PA (US);
Assignee:
Dow Global Technologies LLC, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/00 (2006.01); C09D 5/02 (2006.01); C08L 63/00 (2006.01); C08J 3/05 (2006.01); C04B 26/14 (2006.01); C08J 3/03 (2006.01); C09D 7/02 (2006.01); C09D 7/12 (2006.01); C04B 24/28 (2006.01); C08K 5/41 (2006.01); C04B 28/02 (2006.01); C04B 40/00 (2006.01); B32B 27/38 (2006.01); C04B 111/00 (2006.01); C04B 111/20 (2006.01); C04B 111/27 (2006.01);
U.S. Cl.
CPC ...
C08J 3/05 (2013.01); C04B 24/281 (2013.01); C04B 26/14 (2013.01); C04B 28/02 (2013.01); C04B 40/0039 (2013.01); C08J 3/03 (2013.01); C08K 5/41 (2013.01); C08L 63/00 (2013.01); C09D 5/027 (2013.01); C09D 7/02 (2013.01); C09D 7/1233 (2013.01); C09D 163/00 (2013.01); C04B 2111/00482 (2013.01); C04B 2111/20 (2013.01); C04B 2111/27 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2463/00 (2013.01);
Abstract
The present invention relates to an aqueous epoxy resin blend dispersion of a high mw epoxy resin and a liquid epoxy resin with a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the epoxy resin blend against water is less than 2 dynes/cm, preferably less than 1 dyne/cm, and a process for preparing this epoxy resin blend dispersion. Specifically, the process is a solvent free melt kneading or shearing dispersion process wherein the dispersion is processed at from 50 to 150° C., and the resulting dispersion is stable.