The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Jun. 26, 2015
Seiko Epson Corporation, Tokyo, JP;
Hiroyuki Kobayashi, Azumino, JP;
Hiroshige Owaki, Okaya, JP;
Toshinobu Yamazaki, Niigata, JP;
Hiroyuki Hagiwara, Matsumoto, JP;
Seiko Epson Corporation, , JP;
Abstract
A liquid ejecting head includes a fixing plate which includes a bottom surface which is fixed onto the nozzle surface of each of a plurality of head units which are provided to line up in a state in which a first gap is formed along a first direction, and a first side surface which extends from an edge of the bottom surface which is positioned closer to an outside in the first direction than the lined-up head units to the head unit side. The fixing plate includes a second gap which is formed between the first side surface and the head units which are positioned at ends in the first direction among the head units. The liquid ejecting head also includes a second outer circumferential mold which fills at least a portion of the first gap, and a third outer circumferential mold which fills at least a portion of the second gap. The third outer circumferential mold fills the second gap at a position which is distanced further from the bottom surface than the second outer circumferential mold in a direction which is perpendicular to the bottom surface, and a hardness of the third outer circumferential mold is higher than a hardness of the second outer circumferential mold.