The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Jul. 19, 2013
Applicants:
Hideo Izawa, Narashino, JP;
Reishi Fujiwara, Daisen, JP;
Akira Ishikawa, Narashino, JP;
Inventors:
Assignee:
MIYAKOSHI PRINTING MACHINERY CO., LTD., Narashino-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
B31D 1/02 (2006.01); B23K 26/18 (2006.01); B23K 26/359 (2014.01); B23K 26/08 (2014.01); B23K 26/38 (2014.01); B41J 3/407 (2006.01); B41J 11/66 (2006.01); B23K 26/40 (2014.01);
U.S. Cl.
CPC ...
B31D 1/026 (2013.01); B23K 26/0846 (2013.01); B23K 26/18 (2013.01); B23K 26/359 (2015.10); B23K 26/38 (2013.01); B23K 26/40 (2013.01); B23K 26/402 (2013.01); B31D 1/02 (2013.01); B31D 1/021 (2013.01); B31D 1/027 (2013.01); B41J 3/4075 (2013.01); B41J 11/663 (2013.01); B41J 11/666 (2013.01); B23K 2203/40 (2015.10); B23K 2203/50 (2015.10);
Abstract
A method of half-cut cutout processing of label paperis disclosed that allows laser beamto cut a label sheetof the label paperinto a given cutout shape without damaging a supporting sheet In the method, a cutting locusalong contours of the cutout shape is printed on a surface of the label sheetin a single color which is darker than or equal in darkness to a color that is the darkest of colors in portions to be cut, and then the cutting locusprinted is irradiated with the laser beam, thereby cutting the label sheetselectively into the cutout shape.