The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Mar. 24, 2015
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Tomohisa Takahashi, Hachioji, JP;

Hironobu Ichimura, Akishima, JP;

Tatsuya Daimaru, Hachioji, JP;

Tomokazu Yamashita, Hachioji, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); A61B 1/00 (2006.01); G02B 23/24 (2006.01); A61B 1/06 (2006.01); H04N 5/225 (2006.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
A61B 1/05 (2013.01); A61B 1/00009 (2013.01); A61B 1/0011 (2013.01); A61B 1/00018 (2013.01); A61B 1/00096 (2013.01); A61B 1/051 (2013.01); A61B 1/0669 (2013.01); G02B 23/2423 (2013.01); G02B 23/2484 (2013.01); H04N 5/2257 (2013.01); H04N 5/369 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An imaging module includes: a solid-state imaging element including a light receiving face for receiving light; a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction and which is connected to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction; and a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate.


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