The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Jun. 06, 2012
Applicants:

Rolf Becker, Pfullingen, DE;

Christian Lammers, Stuttgart, DE;

Juergen Jerg, Ofterdingen, DE;

Joachim Wolff, Sonnenbuehl, DE;

Volker Hochholzer, Friolzheim, DE;

Ulrich Trescher, Tuebingen, DE;

Helmut Bubeck, Beilstein, DE;

Klaus Voigtlaender, Wangen, DE;

Jan Benzler, Pliezhausen, DE;

Thomas Raica, Hechingen, DE;

Willi Kuehn, Markgroeningen, DE;

Thomas Wiesa, Vaihingen, DE;

Michael Krapp, Reutlingen, DE;

Inventors:

Rolf Becker, Pfullingen, DE;

Christian Lammers, Stuttgart, DE;

Juergen Jerg, Ofterdingen, DE;

Joachim Wolff, Sonnenbuehl, DE;

Volker Hochholzer, Friolzheim, DE;

Ulrich Trescher, Tuebingen, DE;

Helmut Bubeck, Beilstein, DE;

Klaus Voigtlaender, Wangen, DE;

Jan Benzler, Pliezhausen, DE;

Thomas Raica, Hechingen, DE;

Willi Kuehn, Markgroeningen, DE;

Thomas Wiesa, Vaihingen, DE;

Michael Krapp, Reutlingen, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 7/20 (2006.01); H05K 5/00 (2006.01); F16H 61/00 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); F16H 61/0006 (2013.01); H05K 5/0082 (2013.01); H05K 7/205 (2013.01); H05K 7/20463 (2013.01); H05K 7/20854 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0206 (2013.01); H05K 3/325 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10446 (2013.01); H05K 2203/1147 (2013.01); H05K 2203/1572 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49146 (2015.01);
Abstract

The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.


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